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Glass Microchip Automatic Bonding Device SiMJ200

It is a light scanning type glass microchip automatic bonding system.

This device is an optical scanning glass microchip automatic bonding system. It achieves a significant reduction in bonding time, which was difficult with conventional methods, by selectively scanning and bonding only the areas that require bonding, such as flow paths, using a programmed pattern bonding software. Furthermore, it is also capable of bonding electrode-embedded microfluidic chips, allowing for easy production of functional microchips at your fingertips.

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  • Automatic chip joining device

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